Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent
1998-09-25
2000-09-26
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
257692, 257738, H01L 2348
Patent
active
061246379
ABSTRACT:
A grid array assembly method and apparatus uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and metallization on a first surface and, holes in the substrate which define a contact pad array on the opposite surface. The substrates are tested and acceptable, then mounted on a carrier strip with longitudinally aligned apertures. The carrier strip is typically a metal such as copper. The strip with mounted substrates is then passed to a station where an IC die is mounted on the substrate first surfaces wire bonds are placed from the die to the bonding pads, and the assembly is encapsulated by auto-molding to form a package body. Subsequently, interconnecting bumps are placed on the contact pads and the assembly is removed from the strip.
REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5170328 (1992-12-01), Kruppa
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5376588 (1994-12-01), Pendse
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5420460 (1995-05-01), Massingill
patent: 5477082 (1995-12-01), Buckley, III et al.
patent: 5506756 (1996-04-01), Haley
patent: 5581122 (1996-12-01), Chao et al.
patent: 5654243 (1997-08-01), Yoneda et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5701032 (1997-12-01), Fischer et al.
patent: 5705851 (1998-01-01), Mostafazadeh et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 5732465 (1998-03-01), Tokita et al.
patent: 5852870 (1998-12-01), Freyman et al.
patent: 5854741 (1998-12-01), Shim et al.
patent: 5905633 (1999-05-01), Shim et al.
Schueller R.D.: "Design Considerations for a Reliable Low Cost Tape Ball Grid Array Package", International Journal of Microcircuits and Electronic Packaging, vo. 19, No. 2, Apr. 1996, pp. 146-154, XP000639477.
Hattas, D., et al: "Mounting Technology of GBA-P and GBA-T", 17th IEEE/CPMT Int'l Electronics Manufacturing Technoloogy Symposium, Austin, Oct. 2-4, 1995. IEEE, pp. 417-421, XP000580510.
Karnezos, M., et al: Flex Tape Ball Grid Array, 1996 Proceedings of 46th Electronic Components and Technology Conf., May 28-31,1996, IEEE, pp. 1271-1277, XP000684990.
Design Considerations for a Reliable Low Cost Tape Ball Grid Array Package, 3M Electronic Products Division, R.D. Schueller, Ph.D., Published in Proceedings of IEPS Conference, San Diego, CA, Sep., 1995, pp. 1-14.
Darveaux Robert F.
Freyman Bruce J.
Amkor Technology Inc.
Chaudhuri Olik
Wille Douglas A.
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