Patent
1991-02-06
1992-07-21
James, Andrew J.
357 74, 357 68, H01L 2304, H01L 2306, H01L 2308
Patent
active
051327732
ABSTRACT:
A two-piece carrier ring is provided. First and second rings are affixed to opposing sides of the exterior portion of a leadframe and protect the leads from distortion. The rings are molded prior to bonding to the leadframe so that the rings may be formed from a wide variety of plastics. The premolded rings are polymerized prior to bonding preventing distortion of the leads by shrinking of the rings.
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Electronic Materials Handbook, vol. 1, Packaging, (1989), at pp. 209-210, 240-241.
JEDEC Solid State Product Outlines entitled Tapepak.RTM. Molded Carrier Ring Family, pp. 2 of 19-7 of 19.
Braden Jeffrey S.
Penry Matthew D.
Clark S. V.
James Andrew J.
Olin Corporation
Rosenblatt Gregory S.
Weinstein Paul
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