Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-04-28
2001-12-25
Gaffin, Jeffrey (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S801000, C361S802000, C439S447000, C439S544000
Reexamination Certificate
active
06333858
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a carrier module used for contact operations of various kinds of IC devices, and more particularly to a carrier module capable of accurately fixing the IC device at the time of testing the IC device.
2. Description of the Conventional Art
Conventional carrier modules
2
used in a test handler are adapted to be seated on mounting lugs
3
of a tray
1
, as shown in FIG.
1
. The carrier module
2
has a IC receiving portion
4
therein for accommodating the IC device
100
therein.
The tray
1
has plural reinforcements
6
, inside a rectangular frame
5
, arranged at predetermined intervals.
To prevent the displacement of the IC device
100
accommodated in the carrier module
2
, the conventional art uses the carrier module
2
having a latch
7
installed at a predetermined position, as shown in FIG.
2
.
As shown in
FIG. 2
, the latch
7
protrudes, integrally with a body
8
, from a side surface of the IC receiving portion
8
a
. A suction means
9
is used to seat the IC device
100
on a predetermined location of the IC receiving portion
8
a
. When the IC device
100
is seated, the latch
7
fixes the IC device.
On the other hand, to release the IC device
100
, a latch releasing mechanism
7
a
is used to release the latch
7
and then the suction means
9
sucks the released IC device
100
.
However, the conventional carrier module thus constructed has drawbacks in that other extra carrier modules are needed to handle individual IC devices different in size and thickness, and further the considerable time for exchanging a carrier module with others suitable for individual IC devices is required.
Moreover, the reliability of the products are reduced due to the scratching or breakage of the IC device caused by the latch, which may occur during the contact between the IC device and the latch.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a carrier module capable of reducing the carrier module exchanging time by constructing the carrier module suitable for various sizes and thicknesses of the IC devices.
Another object of the present invention is to provide a carrier module offering an accurate electric contact between a test socket and leads at a test site, and capable of preventing scratching and breakage of the IC device by a latch of the carrier module.
According to one aspect of the present invention, there is provided a carrier module comprising: a body having an insertion groove formed therein in a predetermined direction and holes; elastic means inserted and fixed to the insertion groove, for being elastically moved upward and downward; a latch installed on upper portion of the elastic means, and for fixing an IC device; and a pin for fixing the latch, by being inserted and fixed into the body, wherein the IC device is fixed or released by operation of the latch.
According to another aspect to the present invention, there is also provided a carrier module comprising: a body having at least one or more guide means; a latch for fixing or releasing IC device which is seated on the body; a connecting piece connected to lower portion of the latch, and adapted to be moved together with the movement of the latch; and a support block to which a predetermined portion of the connecting piece is inserted to be coupled, and configured to move upward or downward the connecting piece by being mutually connected by means of a connecting pin.
REFERENCES:
patent: 4786256 (1988-11-01), Angeleri et al.
patent: 4789345 (1988-12-01), Carter
patent: 5249972 (1993-10-01), Walker
patent: 5335002 (1994-08-01), Nagahata et al.
patent: 5364284 (1994-11-01), Tohyama et al.
patent: 5429523 (1995-07-01), Tondreault
patent: 5752846 (1998-05-01), Abe
patent: 5823794 (1998-10-01), Abe
Jung Back Woon
Jung Ki Hyun
Lee Ki Hyun
Yun Sang Jae
Bui Hung
Gaffin Jeffrey
Mirae Corporation
Rosenberg , Klein & Lee
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