Carrier materials impregnated with thermosetting resins, process

Details Carrier materials impregnated with thermosetting resins, process Carrier materials impregnated with thermosetting resins, process

1979-01-12

1981-01-20

Ansher, Harold

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

204 16, 204158HE, 20415915, 427 35, 427 41, 427 44, 427 541, 427 55, 427140, 427148, 428345, 428349, 428531, 428913, 428914, B05D 306, B05D 302, B32B 3500, B32B 3128

Patent

active

042463157

ABSTRACT:
Described herein is a resin-cured carrier material and a process for preparing a resin-cured carrier material. The carrier material has two oppositely disposed major surfaces and a core therebetween, the core being impregnated with at least one heat-cured thermosetting resin and at least one of the two surfaces having a coating of at least one polymerization resin curable by U.V.-radiation, electron radiation or the radiation of radio-active isotopes.

REFERENCES:
patent: 2769742 (1956-11-01), Helbing
patent: 3188266 (1965-06-01), Charbonneau et al.
patent: 3294622 (1966-12-01), Wark
patent: 3309221 (1967-03-01), Smith
patent: 3389011 (1968-06-01), Svensson
patent: 3445327 (1969-05-01), Fuerst
patent: 3899611 (1975-08-01), Hall
patent: 3935330 (1976-01-01), Smith et al.
patent: 3959521 (1976-05-01), Suetsugi et al.
patent: 4009364 (1977-02-01), Ladstadter
patent: 4022926 (1977-05-01), Keough et al.
patent: 4035274 (1977-07-01), McGinniss
patent: 4170664 (1979-10-01), Spenadel et al.
patent: 4179529 (1979-12-01), Vetter

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