Carrier head for workpiece planarization/polishing

Abrading – Machine – Rotary tool

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S398000, C451S388000

Reexamination Certificate

active

07402098

ABSTRACT:
An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system comprises first and second annular ribs, each of which comprises a first end portion sealingly coupled to the carrier head housing, a second end portion coupled to the diaphragm, and a strain relief member substantially intermediate the first end portion and the second end portion. A plenum is substantially defined by the first and second annular ribs and the carrier head housing. The passage is fluidly coupled to the plenum to permit the pressurization of the plenum, and the strain relief member promotes the extension of the first and second annular ribs away from the carrier head housing when the plenum is pressurized.

REFERENCES:
patent: 5964653 (1999-10-01), Perlov et al.
patent: 6659850 (2003-12-01), Korovin et al.
patent: 6663466 (2003-12-01), Chen et al.
patent: 6872130 (2005-03-01), Zuniga
patent: 6957998 (2005-10-01), Togawa
patent: 7207871 (2007-04-01), Zuniga et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier head for workpiece planarization/polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier head for workpiece planarization/polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier head for workpiece planarization/polishing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2811434

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.