Carrier head for chemical mechanical polishing apparatus

Details Carrier head for chemical mechanical polishing apparatus Carrier head for chemical mechanical polishing apparatus

2006-10-17

2006-10-17

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Rotary tool

C451S288000, C451S289000, C451S398000, C451S494000

Reexamination Certificate

active

07121934

ABSTRACT:
Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Pressure applied to the adjustment chamber is transferred to a rear surface of a membrane during a polishing process through a perforated hole formed at a center of the membrane lower holder. A center portion of the membrane is connected to a vacuum pipe by passing through a hole of the membrane lower holder and the adjustment chamber. Vacuum pressure is directly applied to a wafer so that the wafer is easily attached to the carrier head at lower pressure. Pressure is evenly distributed over the whole area of the wafer so that the wafer is evenly polished.

REFERENCES:
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5762544 (1998-06-01), Zuniga et al.
patent: 5957751 (1999-09-01), Govzman et al.
patent: 6162116 (2000-12-01), Zuniga et al.
patent: 6224472 (2001-05-01), Lai et al.
patent: 6435949 (2002-08-01), Katsuoka et al.
patent: 6540590 (2003-04-01), Kajiwara et al.
patent: 6558232 (2003-05-01), Kajiwara et al.
patent: 6767276 (2004-07-01), Keller
patent: 6852019 (2005-02-01), Togawa et al.
patent: 6893327 (2005-05-01), Kajiwara et al.
patent: 6966822 (2005-11-01), Kajiwara et al.
patent: 9168969 (1997-06-01), None
patent: 2000-0071788 (2000-11-01), None

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