Carrier having interchangeable substrate used for testing of sem

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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439266, G01R 3102, G01R 1073

Patent

active

058444181

ABSTRACT:
A carrier for testing a singularized semiconductor die prior to packaging the die utilizes a removable die supporting substrate. The die is placed in the carrier and is electrically connected to the substrate, thereby allowing for the packaging or other use of only known good die. A bridge clamp presses against a rigid cover which, in turn, bias the die against a plurality of die contacting members located on the die supporting substrate. The use of the removable die supporting substrate permits a single carrier design to accommodate different die types and further permits handling equipment to mechanically handle the one carrier design. This facilitates the handling of the carrier so that the carrier can be conveniently used during burn-in and test procedures.

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