Data processing: generic control systems or specific application – Specific application – apparatus or process – Article handling
Reexamination Certificate
2000-02-01
2002-09-03
Valenza, Joseph E. (Department: 3651)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Article handling
C700S230000, C198S345100
Reexamination Certificate
active
06445977
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a carrier handling apparatus for a module IC (integrated circuit) handler and method therefor, used for testing the performances of the module ICs having been produced, and more particularly to a carrier handling apparatus for a module IC handler and method therefor, for performing effective tests while carrier having a plural module ICs therein are transferred between the processes, and providing the carrier being capable of loading and transferring the module ICs with various lengths.
2. Description of the Conventional Art
Typically, a module IC refers to a structure provided with a substrate having one side or both sides thereof for fixedly mounting a plurality of ICs and electronic components, for example, by soldering, and has a function for extending a capacity when it is mounted at a mother substrate.
Such module IC provides higher added-value when sold, as compared with individual sale of each IC as a final product. To this end, the IC manufactures tend to develop it as main product and sell it.
However, the module IC as a product available from the market is relatively expensive and thus entails higher reliability as an important factor. This requires strict quality test for passing only product determined to be good, and otherwise, modifying or discarding all the module ICs determined to be not good.
In the prior art, there has been no apparatus for automatically loading the module ICs as final products into a test socket, testing the same, classifying into respective categories depending upon the test results and then unloading the classified modules into the customer trays.
To test the completed module ICs, the operator manually has to pick up one piece of the module IC from the test tray in which the module ICs are contained therein, load it into the test socket, conducts the test for a time period preset, and finally classify the module IC depending upon the test result in order to put it the customer tray. This results in lower productivity due to the manual work.
Further, such tedious repetition contributes to lower productivity.
To solve such a problem, the inventors developed an automatic module IC handler adapted to test the module ICs, disclosed in Korean patent and utility model applications.
FIG. 1
is a schematic plan view showing the prior module IC handler. The following is to explain the method for handling the module ICs contained in the tray.
A loading side picker
6
is shown which is adapted to move along the X-Y axes
4
,
5
. The picker
6
moves to a tray
4
located at a loading side, and then descends. Then, the picker
6
picks up plural module ICs from the tray, and then holds same.
After the picker
6
holding the module ICs elevates up to the top dead point thereof, the picker
6
then moves to a test site
7
along the X-Y axes
4
,
5
. The picker
6
, after arriving at the test site
7
and being moved downward, places the plural module ICs on tops of test sockets positioned at the test site
7
.
Such sequential procedures permit the placement of the plural module ICs on the test sockets. This is repeatedly performed until all test sockets at the test site
7
have the module ICs therein, respectively.
After the plural module ICs have been placed on the test sockets, all the ICs are simultaneously pushed downward so that patterns formed at both sides of the module IC can be in contact with terminals of the test socket.
The module ICs are tested for a time period preset by a tester. The performance test results are reported to a central processing unit.
After the test for the module ICs has been finished, a separate pusher is operated to discharge the module ICs from the test sockets. At this time, an unloading side picker
8
, disposed on the Y-axis, holds plural module ICs from the test-sockets, classifies same depending on the test results, and then places the sorted ICs into a customer tray
9
.
The details of the above-mentioned procedures are given below. With fingers of the picker
6
for holding both edges of the module IC being fully opened, the loading side picker
6
is moved to the tray
3
in order to hold the module ICs contained in the tray
3
.
After the loading side picker
6
, under such a condition of the picker
6
, is moved to the tray
3
along the X-Y axes
4
,
5
, the picker
6
is positioned above the module IC, and then descends at that position, the fingers are moved inwardly toward each other to hold the module IC.
The picker
6
holding the module IC by such procedures is moved to the test site, and then descends. The fingers are outwardly spread to place the module IC on the test socket. After the plural module ICs are placed on the test sockets by the loading side picker
6
, the loading side picker
6
is moved to the tray side so as to hold new module ICs.
With the repetition of such sequential procedures, the module ICs to be tested can be loaded into the plural test sockets located at the test site. Thereafter, a main cylinder and poking cylinder are operated to drive the pusher to be moved downward. The downward movement of the pusher presses top surfaces of the module ICs placed on the test sockets. Therefore, the patterns formed at both sides of the module IC can be in contact with terminals of the test socket. The performance tests for the module ICs can thus be achieved.
After the completion of the tests for the module ICs, a discharging cylinder is made driven to rotate a discharging lever for extracting the module ICs inserted into the test sockets. Thereafter, another picker at the unloading side is moved to the test site side along the X-Y axes
4
,
5
and holds the module ICs IC having finished the test. The module ICs classified according to the test results are placed into the customer tray.
However, since the prior handler is operated in such a manner that it uses the loading side picker to hold the module ICs and to directly transfer the held ICs into test socket located at the test site, the following problems are caused.
Firstly, since the picker holds the module ICs to load/unload the IC into/from test socket, the picker cannot be used to handle the module ICs in a sealed chamber, and therefore only the tests under a room temperatures is possible.
Thus, the module ICs passed in the tests, but tested only at a normal temperature, become available from the market. However, because the module IC is actually driven at higher temperature in using such a module IC mounted on the appliances, there occurs a difference between both conditions at the test and at an actual use of the IC, thus resulting in lower reliability of the product discharged.
Secondly, since the module ICs in the tray and in the test socket are held and transferred by the picker, the transfer of the module IC cannot be made during the tests. Therefore, an elongated cycle time is introduced, by which lots of module ICs cannot be tested during a time interval given.
Finally, since the module ICs are directly handled by the picker, it permits only a horizontal installation of the test socket in the test site. In case another type of the module ICs are to be tested, inconvenience of exchanging the socket assembly occurs.
To sole such problems, it was proposed a scheme of using a carrier for accommodating the module ICs and for carrying the carrier between the test processes so as to further enhance the product reliability.
In case the carrier is used to receive therein the module ICs and transfer the carrier, at first, the loading side picker holds the module ICs in the tray and then sequentially loads same into the carrier horizontally placed at the loading position. The carrier having therein the module ICs is horizontally moved to a loading side rotator to be locked thereto. Then, a shutter of a heating chamber is opened, the carrier is stood at right angle, and this carrier is lowered to release its locked state. While the carrier is moved by one step in the heating chamber, the module IC is heated at a test condition.
The shutter be
Hwang Hyun Joo
Hwang Ji Hyun
Crawford Gene O.
Fleshner & Kim LLP
Mirae Corporation
Valenza Joseph E.
LandOfFree
Carrier handling apparatus for a module IC handler, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Carrier handling apparatus for a module IC handler, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier handling apparatus for a module IC handler, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2860294