Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components
Patent
1997-10-29
1999-07-06
Gehman, Bryon P.
Special receptacle or package
Holder for a removable electrical component
Bar or tapelike carrier for plural components
206706, 174 524, 361813, B65D 7302, H01L 2302
Patent
active
059187468
ABSTRACT:
A one side resin sealing type semiconductor device has a semiconductor element which is mounted on one side of a circuit board. Wiring patterns are provided on both sides of the circuit board. The semiconductor element mount portion is sealed with resin. External connecting terminals, such as soldering balls, are joined to the wiring pattern on the-other side of the circuit board. The method of manufacturing one side resin sealing type semiconductor devices includes the steps of: positioning and disposing the circuit board formed into an individual piece corresponding to a through-hole formed in a rectangular carrier frame; and conveying the circuit board supported by the carrier frame so as to conduct a series of processing steps such as mounting the semiconductor element, electrically connecting the semiconductor element with the wiring pattern, sealing the semiconductor element mount portion with resin, and connecting the wiring pattern with the external connecting terminals.
REFERENCES:
patent: 3171535 (1965-03-01), Harris
patent: 3858721 (1975-01-01), Boyer et al.
patent: 4600971 (1986-07-01), Rose et al.
patent: 4611262 (1986-09-01), Galloway et al.
patent: 4616416 (1986-10-01), Cabaud
patent: 4617708 (1986-10-01), Fanning
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 5085362 (1992-02-01), Art et al.
patent: 5119934 (1992-06-01), Karasawa et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5297331 (1994-03-01), Childers
patent: 5309332 (1994-05-01), Wagner et al.
patent: 5349236 (1994-09-01), Oshino et al.
patent: 5472085 (1995-12-01), Gelzer
Patent Abstracts of Japan, vol. 015, No. 108 (E-1045), Mar. 14, 1991, JP3001560 (OKI Electric IND Co Ltd) Jan. 8, 1991.
Higashi Mitsutoshi
Tokita Masakuni
Gehman Bryon P.
Shinko Electric Industries Co. Ltd.
LandOfFree
Carrier frame used for circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Carrier frame used for circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier frame used for circuit boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-893390