Carrier frame used for circuit boards

Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components

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Details

206706, 174 524, 361813, B65D 7302, H01L 2302

Patent

active

059187468

ABSTRACT:
A one side resin sealing type semiconductor device has a semiconductor element which is mounted on one side of a circuit board. Wiring patterns are provided on both sides of the circuit board. The semiconductor element mount portion is sealed with resin. External connecting terminals, such as soldering balls, are joined to the wiring pattern on the-other side of the circuit board. The method of manufacturing one side resin sealing type semiconductor devices includes the steps of: positioning and disposing the circuit board formed into an individual piece corresponding to a through-hole formed in a rectangular carrier frame; and conveying the circuit board supported by the carrier frame so as to conduct a series of processing steps such as mounting the semiconductor element, electrically connecting the semiconductor element with the wiring pattern, sealing the semiconductor element mount portion with resin, and connecting the wiring pattern with the external connecting terminals.

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Patent Abstracts of Japan, vol. 015, No. 108 (E-1045), Mar. 14, 1991, JP3001560 (OKI Electric IND Co Ltd) Jan. 8, 1991.

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