Carrier frame for electronic components and production...

Details Carrier frame for electronic components and production... Carrier frame for electronic components and production...

2011-06-14

2011-06-14

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S678000, C257S724000, C257S726000, C257S727000

Reexamination Certificate

active

07960828

ABSTRACT:
The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

REFERENCES:
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patent: 3372310 (1968-03-01), Kantor
patent: 5296741 (1994-03-01), Kim
patent: 6049975 (2000-04-01), Clayton
patent: 6082547 (2000-07-01), Nentl et al.
patent: 6332946 (2001-12-01), Emmett et al.
patent: 7119436 (2006-10-01), Lien
patent: 2002/0089056 (2002-07-01), Eady et al.
patent: 2005/0072715 (2005-04-01), Pylant et al.
patent: 2007/0114660 (2007-05-01), Wang
patent: 2000-049210 (2000-02-01), None

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