Carrier for testing an unpackaged semiconductor die

Details Carrier for testing an unpackaged semiconductor die Carrier for testing an unpackaged semiconductor die

1995-03-01

1996-05-21

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324765, G01R 1073, G01R 3102

Patent

active

055193323

ABSTRACT:
A carrier for testing an unpackaged semiconductor die is provided. The carrier includes a carrier base for supporting the die; an interconnect for establishing a temporary electrical connection with the die; and a force distribution mechanism for biasing the die and interconnect together. In an illustrative embodiment the carrier is formed with a laminated ceramic base. The ceramic base includes internal conductive lines that are wire bonded to the interconnect and metal plated external contacts that are connected to external test circuitry. In an alternate embodiment the carrier is formed with an injection molded plastic base and includes 3-D circuitry formed by a metallization and photolithographic process. In either case, the carrier is adapted for testing different die configurations by interchanging different interconnects.

REFERENCES:
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4417296 (1983-11-01), Schelhorn
patent: 4665468 (1987-05-01), Dohya
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5088190 (1992-02-01), Malhi et al.

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