Carrier for stacked semiconductor die

Details Carrier for stacked semiconductor die Carrier for stacked semiconductor die

1983-01-14

1986-05-20

Moy, Joseph Man-Fu

Special receptacle or package

For a building component

Shingle

220 4E, 206521, 206518, B65D 7302

Patent

active

045895473

ABSTRACT:
A carrier (30) for thin flat electronic devices (36) is provided which has a high volumetric efficiency and is adapted for use with automatic handling equipment. The carrier (30) comprising a hollow tube (31) having a longitudinal interior bore (35) in which is placed a longitudinal cage of metal rails (38) which surround, guide, and hold the devices (36) in a stacked relationship. At least six rails (38) are required to avoid binding and jamming of devices (36) in bore (35). End caps (33a-b) and a moveable resilient plug (34) are used to retain the devices (36) firmly but gently in place to prevent chipping and scratching of the devices (36) during handling and shipment of the carrier (30), and to vary the capacity of the carrier (30). The carrier (30) is rugged, reuseable, and has a volumetric efficiency (devices/unit volume) three to eighteen times higher than prior art egg-crate type device carriers.

REFERENCES:
patent: 2800945 (1957-07-01), Schilling
patent: 2858014 (1958-10-01), Koziol
patent: 2899050 (1959-08-01), Collins, Jr.
patent: 3048668 (1962-08-01), Weiss
patent: 4346817 (1982-08-01), Karcher
patent: 4353481 (1982-10-01), Tando
patent: 4359157 (1982-11-01), Horstmann

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