Carrier for mounting a semiconductor chip and method therefor

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29589, 357 80, 174 52R, B01J 1700

Patent

active

039614158

ABSTRACT:
An assembly and method for mounting a transistor chip on a carrier with lead attachment allows a circuit to approach the limitations of the transistor chip rather than to be limited by the transistor package and attached leads. The carrier is provided with a groove into which the transistor chip is placed so that the surface thereof defining the emitter is flush with a surface of the carrier. A wide but short ribbon lead is bonded from the emitter to the adjustment flush surface of the carrier so that both the characteristic impedance and the wire length are decreased to minimize the value of emitter inductance.

REFERENCES:
patent: 3271507 (1966-09-01), Elliot
patent: 3577633 (1971-05-01), Homma

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