Carrier for mounting a semiconductor chip

Details Carrier for mounting a semiconductor chip Carrier for mounting a semiconductor chip

1977-07-21

1978-05-30

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 74, 357 81, 174 52S, 333 84M, H01L 3902, H01L 2328, H01L 2302

Patent

active

040926648

ABSTRACT:
An assembly and method for mounting a transistor chip on a carrier with lead attachment allows a circuit to approach the limitations of the transistor chip rather than to be limited by the transistor package and attached leads. The carrier is provided with a groove into which the transistor chip is placed so that the surface thereof defining the emitter is flush with a surface of the carrier. A wide but short ribbon lead is bonded from the emitter to the adjacent flush surface of the carrier so that both the characteristic impedance and the wire length are decreased to minimize the value of emitter inductance.

REFERENCES:
patent: 3231797 (1966-01-01), Koch
patent: 3254274 (1966-05-01), Garcia et al.
patent: 3271507 (1966-09-01), Elliott
patent: 3274459 (1966-09-01), Sterzer
patent: 3404214 (1968-10-01), Elliott
patent: 3590341 (1971-06-01), Preston
patent: 3740672 (1973-06-01), Dresser
patent: 3748544 (1973-07-01), Noren
patent: 3828228 (1974-08-01), Wong et al.
patent: 3886505 (1975-05-01), Jacobson

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