Carrier for a leadless integrated circuit chip

Details Carrier for a leadless integrated circuit chip Carrier for a leadless integrated circuit chip

1982-02-19

1984-04-24

Dixson, Jr., William T.

Special receptacle or package

For a building component

Shingle

206328, 339 19, B65D 8500, H01R 1354

Patent

active

044443099

ABSTRACT:
A carrier for a leadless integrated circuit chip has a cavity into which a chip is laterally inserted through an opening in a side wall of the carrier. A spring arm formed integrally with the carrier flexes backward in a recess to permit insertion of the chip, which has a plurality of electrical contact pads on its upper surface, and then bears against the chip under an internal spring bias to retain it within the cavity. Tabs at the upper corners of the cavity are positioned over the corners of the chip which are free of electrical contact pads, thereby preventing the chip from escaping while exposing the pads for both single and dual pin probing. The external configuration of the carrier conforms to industry standards so that the chip can be fully processed and tested without removing it from the carrier.

REFERENCES:
patent: 3892312 (1975-07-01), Tems
patent: 3904262 (1975-09-01), Cutchaw
patent: 4323155 (1982-04-01), Kling

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