Carrier film with conductive adhesive for dicing of semiconducto

Details Carrier film with conductive adhesive for dicing of semiconducto Carrier film with conductive adhesive for dicing of semiconducto

1986-03-06

1990-10-09

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156235, 156249, 156268, 156277, 156289, 156302, 156315, 156344, 252511, 252512, 4272082, 428 40, 428202, 428206, 428352, B32B 3100

Patent

active

049618040

ABSTRACT:
A dicing film to support semiconductor wafers as they are diced into individual chips comprises a support film (e.g., of thermoplastic polymer), a release layer on one side of the film, and a pattern of conductive adhesive attached to the release layer for bonding to the wafer or wafers. The release layer allows for separation of the chip/conductive adhesive combination from the support film. Preferably, the adhesive is covered by a removable release liner prior to mating of the wafer and adhesive.

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patent: 4606962 (1986-08-01), Reylek et al.
Japanese Kokai No. 58/112,335, Jublished Jul. 4, 1983, (abstracted in Chem. Abstr., 100, 35502a, (1984).
"Module cover Sealing", by P. W. Schuessler, IBM Technical Disclosure Bulletin, vol. 18, No. 6, p. 1796 (Nov. 1975).
Patents Abstract of Japan, vol. 6, No. 144 (E-122) [1022], Aug. 3, 1982.
Patents Abstract of Japan, vol. 6, No. 247 (E-146). [1125], Dec. 7, 1982.

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