Carrier film and process for producing the same

Details Carrier film and process for producing the same Carrier film and process for producing the same

1998-08-26

2000-12-05

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

B32B 1500

Patent

active

061564141

ABSTRACT:
The present invention provides a carrier film in which a cover resist layer made of epoxy acrylate resin including a fluorene skeleton is formed on a heat-resistant resin film including a conductive wiring pattern. The carrier film has heat resistance, moisture resistance, and close contact property, as well as chemical resistance in a plating process or the like, and does not warp because contraction in resin hardening is small.

REFERENCES:
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patent: 5539064 (1996-07-01), Hashimoto et al.
patent: 5700607 (1997-12-01), Rath et al.
patent: 5830563 (1998-11-01), Shimoto et al.
patent: 5889233 (1999-03-01), Shimoto et al.
S. Matsuda et al., "Development of Molded Fine-pitch Ball Grid Array (FPBGA) Using Through-Hole Bonding Process", IEEE Electronics Components and Technology Conference, May 28-31, 1996, pp. 727-732.

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