Carrier film and integrated circuit device using the same and me

Details Carrier film and integrated circuit device using the same and me Carrier film and integrated circuit device using the same and me

1998-02-09

2000-06-20

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257737, 257778, 257780, H01L 2348

Patent

active

060781041

ABSTRACT:
A film, on which external electrodes and wire leads are disposed, is divided into two regions. A first region in which an integrated circuit element is disposed and a second region external to the first region. Connection holes are provided in a border area between the first and second regions for connecting the integrated circuit element and electrodes. External electrodes are provided on the first and second regions for connecting to an external substrate. The external electrodes are disposed to form a common matrix. When connecting external electrodes to an external substrate, connections to the external substrate are made in a region corresponding to an integrated circuit element.

REFERENCES:
patent: 5506756 (1996-04-01), Haley
patent: 5777391 (1998-07-01), Nakamura et al.
Japanese Patent Abstract No. 07-249654, Sep. 26, 1995.
Japanese Patent Abstract No. 05-226409, Sep. 3, 1993.

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