Carrier element to be incorporated into an identity card

Details Carrier element to be incorporated into an identity card Carrier element to be incorporated into an identity card

1990-09-12

1991-06-25

Jackson, Jr., Jerome

Registers

Coded record sensors

Particular sensor structure

357 72, 235492, H01L 2328, H01L 2312

Patent

active

050271903

ABSTRACT:
A carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

REFERENCES:
patent: 4216577 (1980-08-01), Badet et al.
patent: 4222516 (1980-09-01), Badet et al.
patent: 4649418 (1987-03-01), Uden
patent: 4701236 (1987-10-01), Vieilledent

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