Carrier element for an IC module

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Details

357 80, 357 68, H01L 21283, H01L 2308, H01L 2312

Patent

active

047092548

ABSTRACT:
A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

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patent: 4264917 (1981-04-01), Ugon
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4336551 (1982-06-01), Fujita et al.

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