1984-09-10
1987-11-24
James, Andrew J.
357 80, 357 68, H01L 21283, H01L 2308, H01L 2312
Patent
active
047092548
ABSTRACT:
A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.
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Haghiri-Tehrani Yahya
Hoppe Joachim
Clark S. V.
Gao Gessellschaft fur Automation und Organisation mbH
James Andrew J.
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