Carrier element for an IC module

Registers – Records – Laminated

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29827, 174 52FP, 235487, 235492, 428596, 357 70, 357 74, 228 51, G06K 1902, H01R 4300

Patent

active

044608250

ABSTRACT:
A carrier element for an IC module (integrated circuit) comprising leads which are connected at one end with the corresponding terminals of the module and at the other end have a contact surface. The ends of the leads running into the contact surfaces extend unsupported beyond the edge of the carrier so that they can be bent into the desired position according to the intended purpose of the carrier element. When the leads are bent around the carrier plane towards the back surface of the module and united by using a castable material in a casting the result is a compact carrier element well adapted to the dimensions of the IC module. For the incorporation of the carrier element according to the invention into an identification card the free ends of the leads can be directed through corresponding recesses in the cover film of the card. During lamination of the layers of the identification card the ends of the leads are bent onto the cover film and thus pressed into the film material.

REFERENCES:
patent: 3611269 (1971-10-01), Reed
patent: 3716439 (1973-02-01), Maeda
patent: 3754070 (1973-08-01), Dunn et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 3984739 (1976-10-01), Mochizuki et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4089575 (1978-05-01), Grabbe
patent: 4142287 (1979-03-01), Grabbe
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4210462 (1980-07-01), Tourneux
patent: 4216577 (1980-08-01), Badet et al.
patent: 4222516 (1980-09-01), Badet et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier element for an IC module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier element for an IC module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier element for an IC module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1492740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.