Carrier element for an IC module

Electricity: electrical systems and devices – Discharging or preventing accumulation of electric charge – Specific conduction means or dissipator

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

235488, 361212, 361401, 361418, H05K 118

Patent

active

046176055

ABSTRACT:
A carrier element for an IC module for incorporation into data carriers, in which the IC module is connectd with contact surfaces by means of leads, and the contact surfaces are designed for direct contacting.
In order to protect the Integrated Circuit against destruction due to static charges, measures are provided to dissipate outside the circuit any portions of charge that may occur. In one embodiment, all terminals of the circuit have a low resistance connection with each other. The connection is suspended during each operational phase and is then restored. In a further embodiment, the terminals are bridged by spark gaps. This protective step is advantageous in that it is not necessary to remove and then restore the bridging.

REFERENCES:
patent: 3045143 (1962-07-01), Schickel
patent: 3405329 (1968-10-01), Loro et al.
patent: 3676742 (1972-07-01), Russel et al.
patent: 3774075 (1973-11-01), Medesha
patent: 4216577 (1980-08-01), Badet et al.
patent: 4222516 (1980-09-01), Badet et al.
patent: 4241829 (1980-12-01), Hardy
patent: 4303960 (1981-12-01), Sherwood et al.
patent: 4308953 (1982-01-01), Cohen
patent: 4316231 (1982-02-01), Michel
patent: 4322777 (1982-03-01), Ueta et al.
patent: 4361756 (1982-11-01), Parmentier
B. G. Kleen, Printed Circuit Spark-Gap Protector, IBM Tech. Disc. Bull., V. 14 #2, p. 638, Jul. 1972.
D. E. DeBar et al., Module Spark Gap, IBM Tech. Disc. Bull. V. 18, No. 7, Dec. 1975.
Capousis et al., Protective Container for Integrated Circuit Modules, IBM Tech. Disc. Bull., V. 17, No. 10, Mar. 1975, pp. 2972 & 2973.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier element for an IC module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier element for an IC module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier element for an IC module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1343688

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.