Carrier element for an IC-module

Details Carrier element for an IC-module Carrier element for an IC-module

1987-05-18

1989-02-07

James, Andrew J.

357 74, 357 80, H01L 2330, H01L 2314, H01L 2348

Patent

active

048035424

ABSTRACT:
A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

REFERENCES:
patent: 3848077 (1974-11-01), Whitman
patent: 4064552 (1977-12-01), Angelucci et al.
patent: 4264917 (1981-04-01), Ugon
patent: 4709254 (1987-11-01), Haghiri-Tehrani et al.

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