Carrier-attached copper foil and printed board using the...

Stock material or miscellaneous articles – Composite – Of metal

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S195100, C428S192000, C428S418000, C428S607000, C428S626000

Reexamination Certificate

active

06960391

ABSTRACT:
The present invention relates to a carrier-added copper foil and a print substrate using such copper foil characterized in comprising a resin layer and a functional material layer at least on a part of the copper foil. A carrier-added copper foil and a print substrate using such copper foil are obtained by forming an insulating layer and functional material layer having an area smaller than the area of the copper foil on the surface of the carrier-added copper foil with the screen printing method, thereby improving the handling of such copper foil, preventing the adhesion of contaminants such as resin powder on the copper foil surface during the cutting procedure, preventing scratches and dimples caused by foreign matter, and effectively preventing the generation of scratches, wrinkles and creases during the cutting, packaging and transportation procedures.

REFERENCES:
patent: 4661417 (1987-04-01), Suzuki et al.
patent: 5709957 (1998-01-01), Chiang et al.
patent: 6562179 (2003-05-01), Ikeguchi et al.
patent: 6610417 (2003-08-01), Andresakis et al.
patent: 2002/0004124 (2002-01-01), Hirasawa et al.
patent: 2004/0043327 (2004-03-01), Sugano et al.
patent: 2005/0003169 (2005-01-01), Ikeguchi et al.
patent: 0 960 725 (1999-12-01), None
patent: 1 097 959 (2001-05-01), None
patent: 03-112190 (1991-05-01), None
patent: 2002-026475 (2002-01-01), None
patent: WO 98/51485 (1998-11-01), None
Patent Abstracts of Japan, One page English Abstract of JP 03-112190.
Patent Abstracts of Japan, One page English Abstract of JP 2002-026475.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier-attached copper foil and printed board using the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier-attached copper foil and printed board using the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier-attached copper foil and printed board using the... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3521548

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.