Carrier and CMP apparatus

Details Carrier and CMP apparatus Carrier and CMP apparatus

1998-09-08

2000-01-11

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 41, 451 9, 451288, 451287, B24B 100

Patent

active

060129646

ABSTRACT:
A carrier and CMP apparatus which improve the uniformity of polishing in a wafer or other workpiece and increase the margin of the amount of wear of the retainer ring to improve the operating rate of the CMP apparatus. A carrier 1 is constituted by a housing 10, a carrier base 11, a retainer ring 12, a sheet supporter 13, a hard sheet 18, and a soft backing sheet 19. The sheet supporter 13 is formed by a supporter body portion 14 having an air opening 14a communicating with an air outlet/inlet 11b of the carrier base 11, a flexible diaphragm 15, and an edge ring 16. Therefore, a wafer W is uniformly pressed by the air pressure in the pressure chamber R and fluctuation in the force pressing against the outer peripheral rim of the wafer W caused by the wear of the retainer ring 12 is countered by the diaphragm 15.

REFERENCES:
patent: 5423176 (1995-06-01), Strausbaugh
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5791973 (1998-08-01), Nishio
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5879220 (1999-03-01), Hasegawa et al.
patent: 5938884 (1999-08-01), Hoshizaki et al.
European Search Report Mar. 19, 1999.

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