Carrier

Details Carrier Carrier

2006-04-04

2006-04-04

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S773000, C257S775000

Reexamination Certificate

active

07023095

ABSTRACT:
A carrier is provided. The carrier is bonded with a substrate having a number of contact pads through an anisotropic conductive film by thermocompression. The carrier includes a base and a number of leads, wherein the base has a base's surface on which a number of indented patterns are disposed. The leads are disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns; meanwhile, part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded to the substrate by thermocompression.

REFERENCES:
patent: 5628852 (1997-05-01), Ishida
patent: 2003/0155656 (2003-08-01), Chiu et al.

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