Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-03-29
1995-05-23
Ledynh, Bot
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361792, 257700, 257779, 174260, 174261, 174263, H05K 114
Patent
active
054186889
ABSTRACT:
An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132, 140) for connection to at least one electronic component (142) and a second circuit pattern disposed on a second substrate (104). The second circuit pattern disposed on the second substrate (104) is selectively processed to further provide pretinned connection pads (110, 118, 126) for connection to the first circuit pattern, and the second substrate (104) further has relief provided within a portion thereof to position the at least one electronic component (142) with respect to the pretinned connection pads (108, 116, 124, 132, 140) on the first circuit pattern. The pretinned connection pads (108, 116, 124, 132, 140, 110, 118, 126) are processed using a low residue fluxing agent to enable processing of the first (102) and second (104) substrates and the at least one electronic component (142) in a single operation through an envelope heating device without a requirement for cleaning after reflow.
REFERENCES:
patent: 4288841 (1981-09-01), Gogal
patent: 4558427 (1985-12-01), Takeuchi et al.
patent: 4935745 (1990-06-01), Mori et al.
patent: 5054120 (1991-10-01), Ushiyama et al.
patent: 5079559 (1992-01-01), Umetsu
Braslaw, IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978.
Baker Arthur L. A.
Cook Kenneth
Hertz Allen D.
Tribbey David A.
Ledynh Bot
Macnak Philip P.
Moore John H.
Motorola Inc.
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