Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-10
1998-10-13
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
235488, 235489, 235490, 235492, 235441, 235486, 257678, 257679, 257684, 257688, 257689, 257690, 257699, 257785, 361736, 361679, 361683, 361684, 361686, 361752, 361753, 361733, H05K 702
Patent
active
058221905
ABSTRACT:
A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external terminal electrode sections with a step section formed between the bed section and the external terminal electrode section, the bed sections of the metal frame being electrically connected to the external terminal electrode sections of the semiconductor chip. At least one surface and outer peripheral surface of the semiconductor chip are resin sealed such that at least electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with a resin-sealed body surface. By doing so, a semiconductor package is formed. The semiconductor package is buried in a recess in a card type base board such that the electrode surfaces of the external terminal electrode sections of the metal frame in the semiconductor package is buried substantially flush with an external surface.
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E. Harari, Nikkei Electronics, Feb. 17, 1992, pp. 155-168.
Foster David
Kabushiki Kaisha Toshiba
Picard Leo P.
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