Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2007-09-11
2007-09-11
Nadav, Ori (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S688000, C257S689000, C257S730000
Reexamination Certificate
active
10420985
ABSTRACT:
A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.
REFERENCES:
patent: 7-321438 (1995-12-01), None
patent: 9-162208 (1997-06-01), None
patent: 10-92968 (1998-04-01), None
Ochi Takao
Takata Takashi
Hamre Schumann Mueller & Larson P.C.
Matsushita Electric - Industrial Co., Ltd.
Nadav Ori
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