Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-13
2009-06-09
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S710000, C361S715000, C361S719000, C439S159000, C439S485000, C439S487000
Reexamination Certificate
active
07545638
ABSTRACT:
A card slot according to the present invention is provided with a slot body, a heat sink, a first support and a second support. The slot body is configured to internally store an IC card. The heat sink is provided with a heat sink body and a first spring. The first spring is attached to the substantial center of an upper surface of the heat sink body, and supports the heat sink body. Also, the first spring is lowered with insertion of the IC card inside the slot, and presses the heat sink body downward. The first support is provided with two first leg sections, a first linking section and a first pressing spring. The two first leg sections are arranged facing positions sandwiching the heat sink body close to one end side of the slot body. The first linking section links fellow upper end vicinities of the two first leg sections. The first pressing spring extends from either the first leg sections or the first linking section towards an upper surface of the heat sink body, to press the upper surface of the heat sink body downwards. The second support is provided with two second leg sections, a second linking section and a second pressing spring. The two second leg sections are arranged facing positions sandwiching the heat sink body close to another end side of the slot body. The second linking section links fellow upper end vicinities of the two second leg sections. The second pressing spring extends from either the second leg sections or the second linking section towards an upper surface of the heat sink body, to press the upper surface of the heat sink body downwards.
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Aoto Hiroaki
Hiyama Naoki
Christensen O'Connor Johnson & Kindness PLLC
Datskovskiy Michael V
Otax Co., Ltd.
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