Card manufacturing technique and resulting card

Details Card manufacturing technique and resulting card Card manufacturing technique and resulting card

2007-01-30

2007-01-30

Potter, Roy Karl (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

10987626

ABSTRACT:
A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer extending to the edges of a circuit board for electrostatic discharge protection but also has gaps at the edge of the ground and/or power layer to avoid short circuiting with conductive segments of another layer deformed when the card is trimmed during manufacture.

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