Card level enclosure system having enhanced thermal transfer...

Details Card level enclosure system having enhanced thermal transfer... Card level enclosure system having enhanced thermal transfer...

2011-08-30

2011-08-30

Lea-Edmonds, Lisa (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S759000, C361S796000, C361S801000, C361S704000, C361S714000, C361S715000

Reexamination Certificate

active

08009435

ABSTRACT:
An enclosure or containment system for expansion cards includes first and second sub-enclosures that interengage to form an enclosure assembly that substantially surrounds the major surface areas of the expansion card while providing support along some of the edges thereof to provide a protected volume that physically protects and shields the electronic and electrical components on the expansion card while providing enhanced heat transfer therefrom.

REFERENCES:
patent: 5008554 (1991-04-01), Asakawa et al.
patent: 5335146 (1994-08-01), Stucke
patent: 7075796 (2006-07-01), Pritchett
patent: 2004/0062013 (2004-04-01), Kim et al.

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