Card comprising at least one electronic element and method of ma

Details Card comprising at least one electronic element and method of ma Card comprising at least one electronic element and method of ma

1994-11-02

1998-04-21

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 87, 156267, 156293, B32B 310, B32B 3106, G11B 580

Patent

active

057413924

ABSTRACT:
One object of the invention concerns a card comprising an electronic element (2) and a coil (42), the ends of which are directly coupled to the electronic element, such latter and the coil being encased in a binding material (10). Another object of the invention concerns a card comprising an electronic element (2) encased in a binding material (10) and a positioning structure (46) for the electronic element, such structure being located in a layer (38) formed by the binding material. The present invention also concerns a method of manufacture for cards according to the invention.

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K.P. Stuby, IBM Technical Disclosure Bulletin, "Flexible Semiconductor Credit Card", Nov. 1979, vol. 22 No. 6, pp. 2336-2337.

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