Carboxylic acid-modified bisphenol epoxy di(meth)acrylate

Details Carboxylic acid-modified bisphenol epoxy di(meth)acrylate Carboxylic acid-modified bisphenol epoxy di(meth)acrylate

2009-04-21

2009-12-15

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

C525S391000, C528S102000, C528S112000

Reexamination Certificate

active

07632912

ABSTRACT:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

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Abstract, Machine Translation, JP 10120611, Katagiri et al., May 12, 1998.

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