Carbon nanotube via interconnect

Details Carbon nanotube via interconnect Carbon nanotube via interconnect

2006-03-29

2008-11-18

Abrams, Neil (Department: 2839)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE51040

Reexamination Certificate

active

07453154

ABSTRACT:
An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.

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Riley, George A., “Wafer-level Hermetic Cavity Packaging”,Advanced Packaging, May 2004, 10 pages.

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