Carbon nanotube thermal interface structures

Details Carbon nanotube thermal interface structures Carbon nanotube thermal interface structures

2005-11-15

2005-11-15

Chang, Yean-Hsi (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S705000

Reexamination Certificate

active

06965513

ABSTRACT:
The invention relates to a process of forming a thermal interface that employs carbon nanotubes to reduce thermal resistance between an electronic device and a cooling solution. Bundles of aligned nanotubes receive injected polymeric material to produce a polymeric/carbon composite which is then placed between the electronic device and a heat sink or other cooling solution.

REFERENCES:
patent: 5753088 (1998-05-01), Olk
patent: 5965267 (1999-10-01), Nolan et al.
patent: 6006168 (1999-12-01), Schumann et al.
patent: 6203814 (2001-03-01), Fisher et al.
patent: 6232706 (2001-05-01), Dai et al.
patent: 6256996 (2001-07-01), Ghoshal
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 2002/0090501 (2002-07-01), Tobita
patent: 2002/0145194 (2002-10-01), O'Connor et al.
patent: 1054036 (2000-11-01), None
patent: 1109218 (2001-06-01), None
patent: WO-00/33628 (2000-06-01), None
patent: WO-01/30694 (2001-05-01), None
patent: WO-01/92381 (2001-12-01), None
Andrews, R. , et al., “Nanotube Composite Carbon Fibers”,Applied Physics Letters, 75, (Aug. 30, 1999), 1329-1331.
Mathis, Nancy, et al., “Thermal Conductivity of Thin Film Carbon Fiber Die Attach”,RETEC'98 Proceedings, (1998), 1-10.

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