Carbon nanotube-based stress sensor

Details Carbon nanotube-based stress sensor Carbon nanotube-based stress sensor

2006-03-24

2009-06-30

Louie, Wai-Sing (Department: 2814)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257S048000, C257SE21521, C977S701000, C977S707000, C977S762000, C977S778000

Reexamination Certificate

active

07553681

ABSTRACT:
An embodiment of the present invention is a technique to form stress sensors on a package in situ. A first array of carbon nanotubes (CNTs) aligned in a first orientation is deposited at a first location on a substrate or a die in a wafer. The first array is intercalated with polymer. The first polymer-intercalated array is covered with a protective layer. A second array of CNTs aligned in a second orientation is deposited at a second location on the substrate or the die. The second array is intercalated with polymer.

REFERENCES:
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patent: 2005/0126766 (2005-06-01), Lee et al.
patent: 2006/0214192 (2006-09-01), Nanai et al.
Zhiling Li, “Carbon Nanotube Film Sensors”, Advanced Materials, 2004, vol. 16, No. 7, pp. 640-643, Apr. 5, 2004.
Louis Liu, “Organic Flip Chip Packaging Design and Manufacturing Challenges”, pp. 263-266.
Nachiket R. Raravikar, “Synthesis and Characterization of Thickness-Aligned Carbon Nanotube—Polymer Composite Films”, Chemical Materials, 2005, vol. 17, pp. 974-983.
Jeffrey C. Suhling, “Silicon Pieoresistive Stress Sensors and Their Application in Electronic Packaging”, IEEE Sensors Journal, vol. 1, No. 1, Jun. 2001.
Dongmok Whang, “Larg-Scale Hierarchical Organization of Nanowire Arrays for Integrated Nanosystems”, Nano Letters, 2003, No. 9, pp. 1255-1259.

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