Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface
Patent
1992-04-02
1994-04-19
Woo, Jay H.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
Shaping against forming surface
26432814, 26432817, 26433119, B29C 4502
Patent
active
053043383
ABSTRACT:
A substantially microcrack- and blister-free composite can be made by drying an addition-type polyimide molding compound under suitable conditions to remove excess moisture. The molding compound includes a mixture of a polyimide resin and a plurality of carbon reinforcing fibers less than 3 mm long. The molding compound is placed into a heated material reservoir and transferred to a heated molding tool with a heated transfer ram. The ram establishes a molding pressure in a mold cavity in the molding tool sufficient to cure the molding compound into the desired composite. The molding compound is transferred to the mold cavity such that the molding compound is heated to a molding temperature at a rate of at least about 85.degree. C./min. The molding pressure and temperature are maintained in the mold cavity for a time sufficient to cure the molding compound into the desired composite. The composite is cooled and then heated to a suitable post-cure temperature at a rate sufficient to permit residual volatiles in the composite to diffuse out of the composite. The composite is held at the post-cure temperature for a sufficient time and then cooled. The invention also includes an article made by this method and a vented molding tool used in the method.
REFERENCES:
patent: 4146668 (1979-03-01), Dorey et al.
patent: 4356228 (1982-09-01), Kobayashi et al.
patent: 4370115 (1983-01-01), Miura
patent: 4485140 (1984-11-01), Gannett et al.
patent: 4506100 (1985-03-01), Schoenberg et al.
patent: 4576857 (1986-03-01), Gannett et al.
patent: 4663230 (1987-05-01), Tennent
patent: 5087644 (1992-02-01), Tsutsumi et al.
patent: 5120814 (1992-06-01), Seidl et al.
patent: 5138028 (1992-08-01), Paul et al.
Hertel Christopher J.
LeShane Jeffrey S.
Watson Charles R.
Davis Robert B.
Sohl Charles E.
United Technologies Corporation
Woo Jay H.
LandOfFree
Carbon fiber reinforced polyimide composites does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Carbon fiber reinforced polyimide composites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carbon fiber reinforced polyimide composites will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-18192