Winding – tensioning – or guiding – Wound storage package – Particular winding
Reexamination Certificate
2011-05-17
2011-05-17
Dondero, William E (Department: 3654)
Winding, tensioning, or guiding
Wound storage package
Particular winding
C242S477400
Reexamination Certificate
active
07942359
ABSTRACT:
It is an object of the present invention to provide a package in an optimal form obtained by winding a carbon fiber bundle having a fineness of 25,000 to 35,000 deniers, which has a high wound density and is less apt to become loose, and a method for producing the same. The present invention is a carbon fiber package obtained by winding a carbon fiber bundle having a fineness of 25,000 to 35,000 deniers on a bobbin in a square-end type, wherein the width per unit fineness of the carbon fiber bundle is in the range of 0.30×10−3to 0.63×10−3mm/denier, the traverse angle in the beginning of winding is in the range of 13 to 14°, the traverse angle in the end of winding is 3° or larger, and the fractional portion W0of the winding ratio W is in the range of 0.07 to 0.08.
REFERENCES:
patent: 4779813 (1988-10-01), Sugioka et al.
patent: 5056724 (1991-10-01), Prodi et al.
patent: 6027060 (2000-02-01), Siepmann
patent: 7762491 (2010-07-01), Schmalholz
patent: 0 893 386 (1999-01-01), None
patent: 7 25479 (1995-03-01), None
patent: 10 316311 (1998-12-01), None
Machine translation of JP10-316311 A.
Machine translation of JP07-025479 B2.
European Search Report issued on Dec. 9, 2010, in European Patent Application No. 07806517.4 (4 pages).
Kiriyama Takayuki
Maki Norihito
Dondero William E
Mitsubishi Rayon Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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