Carbon dioxide gettering method for a chip module assembly

Details Carbon dioxide gettering method for a chip module assembly Carbon dioxide gettering method for a chip module assembly

2006-06-15

2008-12-09

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S143000, C257S682000

Reexamination Certificate

active

07462506

ABSTRACT:
A chip module assembly includes a CO2getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO2getter comprises a liquid composition including 1,8-diaza-bicyclo-[5,4,0]-undec-7-ene (DBU) in a solvent that includes an alcohol, preferably, 1-hexanol. In one embodiment, a sheet of gas-permeable membrane is heat-welded to form a pillow-shaped bag in which the liquid composition is sealed. The pillow-shaped bag containing the liquid composition is preferably disposed in a recess of a heat sink and exposed to the cavity through a passage between the recess and the cavity. The CO2getter can remove a relatively large amount of carbon dioxide from the cavity, and thus effectively prevents solder joint corrosion. For example, based on the formula weights and densities of the DBU and 1-hexanol, 200 g of the liquid composition can remove over 34 g of carbon dioxide.

REFERENCES:
patent: 6972249 (2005-12-01), Akram et al.
patent: 7160368 (2007-01-01), Wakelin
Mulloth et al., “Carbon Dioxide Adsorption on a 5A Zeolite Designed for CO2 Removal in Spacecraft Cabins”, NASA/TM-1998-208752, Nov. 1998.
Jessop et al., “Reversible nonpolar-to-polar solvent”, Nature, vol. 436, p. 1102, Aug. 25, 2005.

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