Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1997-07-09
1999-12-21
Warden, Jill
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 13, 134 6, 134 7, 134 26, 134 40, 134902, 451 38, 451 39, 451 75, 451102, B08B 700
Patent
active
060044004
ABSTRACT:
A method for cleaning parts employed during the processing of semiconductor wafers includes a first cleaning step for removing super-micron particles and a second cleaning step for removing sub-micron particles. The second step utilizes frozen carbon dioxide pellets and removes contaminant particles have a size of less than one micron. The cleaning method consistently removes substantially all sub-micron particles from a work surface.
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Bishop Phillip W.
Harrover Alexander J.
Bishop Phillip W.
Carrillo Sharidan
Nissle, P.C. Tod R.
Warden Jill
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