Carbon dioxide cleaning process

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 13, 134 6, 134 7, 134 26, 134 40, 134902, 451 38, 451 39, 451 75, 451102, B08B 700

Patent

active

060044004

ABSTRACT:
A method for cleaning parts employed during the processing of semiconductor wafers includes a first cleaning step for removing super-micron particles and a second cleaning step for removing sub-micron particles. The second step utilizes frozen carbon dioxide pellets and removes contaminant particles have a size of less than one micron. The cleaning method consistently removes substantially all sub-micron particles from a work surface.

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