Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1981-06-29
1984-01-10
Ramsey, Kenneth J.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
295274, 204 15, 204 41, 228 54, B23K 302
Patent
active
044249306
ABSTRACT:
A soldering or de-soldering tip and method of manufacturing a soldering or de-soldering tip which has a carbon-based body with an attachment portion, an intermediate portion adjoining the attachment portion, and a solder-wetting portion adjoining the intermediate portion. The solder-wetting portion has an exterior coating of iron to provide a wettable working surface, and the intermediate portion has an exterior coating of chrome for localizing the wettable working surface and impeding the upward flow of solder along the intermediate portion and toward the attachment portion. The carbon-based body eliminates premature failure problems caused by the pitting and oxidation of standard copper-based tips.
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Abstract of Application Ser. No. 82,457 Published in Official Gazette of the U.S. Patent Office, vol. 637, p. 1576, Aug. 1950.
Cooper Industries Inc.
Ramsey Kenneth J.
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