Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1985-05-02
1986-06-17
Flint, Jr., J. Howard
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
2642791, 249 83, 249121, 249163, 249167, 249170, B29C 100
Patent
active
045955492
ABSTRACT:
An improved capsule and clamping apparatus and a method of using the same are disclosed. The capsule has a filling end and specimen end with a preformed opening at its filling end. The capsule has portions on the filling end for holding the capsule in a perpendicular position on a slide or the like so that the capsule may be clamped perpendicular in sealed relationship with the slide. Embedding material can then be poured into the filling end of the capsule for quickly preparing an accurate, embedded specimen block for later use, such as preparing sections, and particularly thick sections (1 to 6 microns) on a microtome machine, for microscopic examination.
REFERENCES:
patent: 2235964 (1941-03-01), Meyer et al.
patent: 2704928 (1955-03-01), Curry
patent: 2996762 (1961-08-01), McCormick
patent: 3014614 (1961-12-01), Carroll et al.
patent: 3104665 (1963-09-01), Towns
patent: 3113672 (1963-12-01), Brown
patent: 3565389 (1971-02-01), Price
patent: 3571867 (1971-03-01), Cooke
patent: 3982862 (1976-09-01), Pickett et al.
Inouye Tohru
Tong Lai-Chun J.
Flint, Jr. J. Howard
Syprocode, Inc.
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