Capsulated abrasive composition and polishing pad using the...

Details Capsulated abrasive composition and polishing pad using the... Capsulated abrasive composition and polishing pad using the...

2005-10-11

2005-10-11

Marcheschi, Michael (Department: 1755)

Abrasive tool making process, material, or composition

With synthetic resin

C051S307000, C051S308000, C051S309000, C051S293000

Reexamination Certificate

active

06953489

ABSTRACT:
Capsulated abrasive compositions and a polishing pad using the same. More specifically, a polishing pad coated with compositions, which contain a capsulated abrasive, thereby used for planarizing interlayer insulating film formed on a semiconductor substrate by chemical mechanical polishing.

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patent: 6461226 (2002-10-01), Yi
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patent: 6685540 (2004-02-01), Cherian et al.
patent: 2001-49979 (2001-06-01), None
patent: 2001-111548 (2001-12-01), None
Communication from Korean Intellectual Property Office dated Feb. 27, 2004 with translation (4 pages).

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