Capillary underfill of stacked wafers

Details Capillary underfill of stacked wafers Capillary underfill of stacked wafers

2008-09-30

2008-09-30

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21122

Reexamination Certificate

active

11396044

ABSTRACT:
A plurality of wafers are aligned and stacked on a thermally variable rotary table, the table and stack are rotated, and an underfill material is disposed and cured between wafers in the stack, bonding the wafers. Corresponding wafer portions of the plurality of wafers in the stack may be singulated from the stack, and may comprise semiconductor device packages either individually or when coupled with a substrate.

REFERENCES:
patent: 6093577 (2000-07-01), van der Groen et al.
patent: 6534383 (2003-03-01), Iwane et al.
patent: 6967412 (2005-11-01), Standing
patent: 6984873 (2006-01-01), Kloster et al.
patent: 7042076 (2006-05-01), Geosling

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