Capillary imprinting technique

Details Capillary imprinting technique Capillary imprinting technique

2003-08-21

2008-10-28

Tentoni, Leo B (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to work

Polymerizing, cross-linking, or curing

C264S319000

Reexamination Certificate

active

07442336

ABSTRACT:
The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, spontaneous capillary filling of the volume between the mold and the substrate occurs.

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