Capillary for wire bonding and method of wire bonding using it

Details Capillary for wire bonding and method of wire bonding using it Capillary for wire bonding and method of wire bonding using it

2006-05-30

2006-05-30

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500

Reexamination Certificate

active

07051915

ABSTRACT:
A capillary has a face surface13formed at the tip end thereof so that the face surface13inclines toward the center thereof so as to have a tapered shape, and has a through hole11formed therethrough so as to permit wire to be placed therethrough so that the through hole11has an opening12at the center of the face surface13. The inclination angle θ of the face surface13relative to the plane perpendicular to the axis of the capillary and including the opening12of the through hole11is in the range from 4° to 15°, and the height h of the face surface13along the axis of the capillary is equal to or greater than the thickness of the wire2.

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