Capillary for wire bonding

Details Capillary for wire bonding Capillary for wire bonding

2004-06-24

2008-09-23

Kerns, Kevin P (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500, C228S110100, C228S001100

Reexamination Certificate

active

07427009

ABSTRACT:
A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.

REFERENCES:
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patent: 4974767 (1990-12-01), Alfaro et al.
patent: 5379512 (1995-01-01), Ingle et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5662261 (1997-09-01), Fogal
patent: 6158647 (2000-12-01), Chapman et al.
patent: 6311890 (2001-11-01), Chapman et al.

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