Metal fusion bonding – Process – Plural joints
Patent
1994-04-26
1996-01-23
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228 45, H01L 21603
Patent
active
054859492
ABSTRACT:
The capillary for ball bonding for forming a bump on the electrode pad of a semiconductor device includes a pressing member having a bore therein for supplying a metal wire, and a leveling member. The pressing member presses the ball-like end of the metal wire against the electrode pad in order to secure the ball-like end to the electrode pad under pressure. The leveling member makes the bump formed on the electrode pad to a predetermined height. According to the method of forming a bump using the capillary, first, a ball is formed at the end of the metal wire supplied from the bore. A first portion of the bump is formed by moving the capillary downwards and by securing the ball-like end to the electrode pad under pressure by the pressing member. A second portion of the bump is formed on the first portion by supplying the metal wire while the capillary is moved. When the capillary is moved downwards, a portion of the metal wire constituting the second portion is cut from the remaining portion of the metal wire in the bore by an edge of the pressing member, and simultaneously the bump is leveled by the leveling member.
REFERENCES:
patent: 4415115 (1983-11-01), James
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5364004 (1994-11-01), Davidson
Search Report for European Appl. 94106580.7, mailed Aug. 22, 1994.
"Tab Bumping Technique", (1992) Apr., No. 336, 2244 Research Disclosure.
"High Density I/O Pad Wire Ball Bonding Capillary Tool," (1987) May No. 277; 2244 Research Disclosure.
Bessho Yoshihiro
Tomura Yoshihiro
Heinrich Samuel M.
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Capillary for a wire bonding apparatus and a method for forming does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Capillary for a wire bonding apparatus and a method for forming , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capillary for a wire bonding apparatus and a method for forming will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1500480