Capacity dividable memory IC

Details Capacity dividable memory IC Capacity dividable memory IC

2007-03-13

2007-03-13

Zarabian, Amir (Department: 2827)

Static information storage and retrieval

Interconnection arrangements

C365S072000, C365S230030, C365S244000

Reexamination Certificate

active

11166586

ABSTRACT:
Two memory areas on a wafer are coupled through pass transistors to double the memory capacity of each area and can be sawed to yield two memory chips each with single memory area. A pair of pass transistors are used to couple each dedicated functional pad in both memory areas, when the pass transistors are turned on. The connection between the pass transistor pair can be sawed through to yield single capacity memory dice. The memory capacity can be further increased by coupling more memory areas together with pass transistors.

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